8,000 job offers in CLA’s first career expo of 2013


By Ann Yu, The China Post

TAIPEI, Taiwan — The Council of Labor Affairs (CLA) yesterday kicked off their first career fair after the Chinese New Year, offering roughly 8,000 job positions.

According to CLA Deputy Minister Hau Feng-ming (郝鳳鳴), Taiwan’s economy is improving this year — a sign of more future job offers. He added that the CLA is set to launch nine more career fairs in 2013 and encouraged recent graduates to take advantage of the situation, in which an estimated 50,000 jobs will be on the market.

Employers at the job expo remarked that participants were mostly recent graduates or younger employees seeking a new career path.

Manager Fan Rei-yu (范瑞玉) of Scienctech Corporation (辛耘企業) said that many of the participants, who were mostly part of the younger demographic, had vague ideas about what they were looking for in a career. This showed there is a gap between what our schools are teaching and the skills that are actually needed in the working environment, Fan said. The career fair consisted of 106 companies from the science and technology sector, the service sector and the traditional industry. Science and technology enterprises, such as Taiwan Semiconductor Manufacturing Company (TSMC), comprised 74.9 percent of the firms in attendance, with a total offer of 5829 job positions. Meanwhile service sector companies occupied an 18.6-percent share, with 1458 jobs on offer.

The United Microelectronics Corporation (UMC), mostly seeking technical personnel, offered around 1,000 job positions. Employers said that this year many science parks, such as the Hsinchu Science Park and Tainan Science Park, lacked skilled technical talent.

Along with the science and technology sector, state-owned enterprises began opening more job positions due to the climbing rate of retirement in 2013, according to Economic Ministry officials. State-owned enterprises — Taipower, CPC, Taiwan Water and Taiwan Sugar— are looking to fill 2,000 positions this year, a record high.