TSMC to add 8,000 jobs at its new 3nm fab

Taiwan Semiconductor Manufacturing Co. plans to hire thousands people to develop 3nm fabrication technology. (NOWnews)
Taiwan Semiconductor Manufacturing Co. plans to hire thousands people to develop 3nm fabrication technology. (NOWnews)

TAIPEI (The China Post) — Taiwan Semiconductor Manufacturing Co. (TSMC, 台積電) plans to hire 8,000 people in Research and Development (R&D) to develop 3-nanometer manufacturing technology, according to Chairman Mark Liu (劉德音).

Speaking at an event organized by Taiwan Semiconductor Industry Association on Oct. 31, Liu said TSMC wants to build a Taiwan-edition Bell Laboratories, leading the semiconductor industry in Taiwan further onwards.

To this extent, TSMC has acquired 32.7 hectares in Baoshan Township, Hsinchu County (新竹縣寶山鄉), to build a new R&D center starting in early 2020.

The center, which will focus on developing 3nm chips, will be completed by the end of the year, the Economic Daily News (經濟日報) reported on Friday.

This was the first time someone from TSMC ever spoke on the future use of the new plant,  according to the Chinese-language daily.

The world’s largest dedicated independent semiconductor foundry has reportedly invested more than NT$1.5 trillion (US$50 billion) into developing advanced chips fabrication over the past five years.

The company spent 8 percent of its 2018 revenue (NT$85.8 billion) on R&D; it will increase that budget to 8.6 percent of 2019 revenue which is expected to be more than NT$100 billion.

Building a new plant and pouring large amounts of effort into the 3nm process shows TSMC’s aggressiveness to take the lead in the semiconductor industry.

TSMC and South Korea’s Samsung are the only two manufacturers capable of providing 7nm fabrication and beyond in the world. Both are expected to sell 5nm chips in 2020.

By Carol Kan